Title:
WIRE SAW DEVICE
Document Type and Number:
Japanese Patent JP2020032472
Kind Code:
A
Abstract:
To provide a wire saw device which can be down-sized, and has an effect similar to an oscillation mechanism.SOLUTION: There is provided a wire saw device 1 in which at least one wire 2 is stretched between plural guide rollers 7, 7, and which cuts a work-piece W in such a manner that the wire 2 is caused to run, and the work-piece fixed to a work-piece anchor block 911 is pressed onto the wire 2 laid around the guide roller 7. In the wire saw device, vibration generating means having a frequency of less than 20 kHz and an amplitude of 15 mm or less is provided on the work-piece anchor block 911, and cutting is performed while applying vibration to the work-piece W.SELECTED DRAWING: Figure 1
Inventors:
IMAI TAKANORI
INOUE YUICHI
INOUE YUICHI
Application Number:
JP2018158764A
Publication Date:
March 05, 2020
Filing Date:
August 27, 2018
Export Citation:
Assignee:
TAKATORI CORP
International Classes:
B24B27/06; B23D61/18; B24B47/04; B28D1/08; B28D5/04; H01L21/304