Title:
WIRE SAW AND METHOD FOR CUTTING INGOT
Document Type and Number:
Japanese Patent JP3637740
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a wire saw for reducing warp of a wafer immediately after cutting by suppressing thermal expansion of an ingot occurring at the time of cutting, and a method for cutting the ingot.
SOLUTION: The ingot I is relatively pressed to a wire row 11 reciprocatingly traveling. And, the ingot I is cut into many wafers 19 by grinding action of abrasive grains. In this case, an elevating plate 15 is cooled by a cooling means 19. And, the ingot I is further cooled. Thus, thermal expansion of the ingot I in an axial direction in a bimetal state due to frictional heat generated at the time of cutting the ingot I can be suppressed. As a result, warps of the obtained many wafers or particularly the wafers at both ends of the ingot I can be reduced.
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Inventors:
Tatsunori Kobayashi
Application Number:
JP24472997A
Publication Date:
April 13, 2005
Filing Date:
August 25, 1997
Export Citation:
Assignee:
Mitsubishi Sumitomo Silicon Co., Ltd.
International Classes:
B24B27/06; B28D5/00; B28D5/04; B28D7/02; (IPC1-7): B28D5/04; B24B27/06; B28D7/02
Domestic Patent References:
| JP9123162A | ||||
| JP61121871A | ||||
| JP8039415A | ||||
| JP8323739A | ||||
| JP8323741A | ||||
| JP9019921A | ||||
| JP10193249A |
Attorney, Agent or Firm:
Ichiro Abe
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