To provide a wire solder that is effective for mounting, particularly, for suppressing a void and that is suitable for die bonding and the like, and to provide the efficient manufacturing method of the same.
The wire solder is formed by wire drawing after two or more metallic powders and/or metallic foils of different components are filled in a metallic capillary. The wire solder is a bulk formed body obtained by properly processing the base stock, wherein production of void can be reduced as far as possible by reducing void-generation sources as far as possible. It is a string solder easy to handle and basically having no need of containing components other than metallic components, and having almost no inter-metallic-particle void present therein.
MIYAKE KOICHI
NOUMOTO KAZUYUKI
SHIMAMURA HIROYUKI
