Title:
WIRED ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JP3456454
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain wired electronic parts which can prevent thinning and fusion of its wires by suppressing the Cu melting from a wire to solder as much as possible.
SOLUTION: A chip coil has electrodes 13 each of which is composed of a base metallic (Ag) layer 13a, a plated Ni layer 13b, and a plated Sn-Cu layer 13c at both ends of a core 10. The terminals 16 and 16 of a wire 15 are buried in the plated Sn-Cu layer 13c by thermocompression bonding. When the chip coil is subjected to reflow soldering, the Cu of the plated Sn-Cu layer 13c malts into reflow solder and suppresses the Cu from melting out of the wire 15.
More Like This:
| JPS60251611 | MANUFACTURE OF SEAT COIL |
| JP6826794 | Thin, high current compatible complex transformer |
| JPH01255206 | MANUFACTURE OF MAGNETICALLY SHIELDED INDUCTOR |
Inventors:
Toi Takaomi
Tetsuya Morinaga
Tetsuya Morinaga
Application Number:
JP27907799A
Publication Date:
October 14, 2003
Filing Date:
September 30, 1999
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01F41/04; H01F17/04; H01F27/29; (IPC1-7): H01F27/29
Domestic Patent References:
| JP10312922A | ||||
| JP10321455A | ||||
| JP11205015A | ||||
| JP3159207A | ||||
| JP3145706A | ||||
| JP1041152A |
Attorney, Agent or Firm:
Takekazu Morishita