Title:
WIRING BOARD FOR ELECTRICAL TEST
Document Type and Number:
Japanese Patent JP3584996
Kind Code:
B2
Abstract:
PURPOSE: To provide a wiring board for an electrical test involving resistance measurements for high-density wiring boards such as printed boards, boards for integrated circuits, liquid crystal display boards, etc.
CONSTITUTION: The wiring board for electrical test is composed of an insulating board 5, wiring of a specified pattern buried in the insulating board, and projecting electrodes 7 provided on the wiring to touch the electrodes of a device to be tested, and the tips of the projecting electrodes are covered with conductive resin 9. Consequently, it becomes easy to deal with the narrow pitch of a device pattern to be inspected, and it is possible to prevent the surface electrodes of the device to be tested from being damaged. Besides, it becomes possible to suppress the dispersion of the contact accuracy between planes, and to prolong the life of the projecting electrodes of the wiring board for tests itself.
Inventors:
Hidehiro Nakamura
Masanori Nakamura
Yoshiaki Tsubomatsu
Atsushi Kuwano
Izuo Watanabe
Naoki Fukutomi
Masanori Nakamura
Yoshiaki Tsubomatsu
Atsushi Kuwano
Izuo Watanabe
Naoki Fukutomi
Application Number:
JP31991894A
Publication Date:
November 04, 2004
Filing Date:
December 22, 1994
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
G01R31/02; H05K1/02; H05K3/00; (IPC1-7): H05K3/00; G01R31/02
Domestic Patent References:
| JP51032181A | ||||
| JP5041415A | ||||
| JP5281259A | ||||
| JP2002945A | ||||
| JP2004015066A |