To provide a wiring board, for a high frequency, which can be fired even at 1000°C or lower, whose permittivity is low in a high-frequency region of 1 GHz or higher, whose dielectric dissipation factor is small, which is provided with a high-strength insulation substrate and whose reliability is high.

A wiring board for a high frequency is formed such that a wiring layer which can transmit a high-frequency signal at a frequency of 1 GHz or higher is arranged and installed on the surface or in the interior of an insulating board. The wiring board is featured such that it comprises a sintered body provided with a plurality of crystal phases S containing SiO2, Al2O3, MgO and ZnO as constituent components and with an amorphous phase G which is composed of SiO2 or of SiO2 and of B2O3. In addition, as the crystal phases, a crystal phase which contains at least ZnO and Al2O3 such as a spinel- type crystal phase SP or the like, a crystal phase which contains at least SiO2 and ZnO such as a willemite-type crystal phase W or the like and a crystal phase which contains at least SiO2 and MgO such as an enstatite-type crystal phase E or the like are contained.