配線基板とその製造方法 - Tessera Interconnect Materials, Inc.

Title:

配線基板とその製造方法

Document Type and Number:

Japanese Patent JP4190659

Kind Code:

B2

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Inventors:

Iijima Asao

Application Number:

JP14167699A

Publication Date:

December 03, 2008

Filing Date:

May 21, 1999

Export Citation:

Assignee:

Tessera Interconnect Materials, Inc.

International Classes:

H05K3/46; H01L23/12

Domestic Patent References:

Attorney, Agent or Firm:

Shoichi Okuyama
Fukagawa Eri
Arihara Koichi
Matsushima Tetsuo
Hideaki Ogawa

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