Title:
配線基板及びその製造方法と電子部品装置
Document Type and Number:
Japanese Patent JP6691451
Kind Code:
B2
Abstract:
A wiring board includes: an insulating layer; and a wiring layer including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the upper surface of the wiring layer is exposed from the insulating layer, and the side surface and the lower surface of the wiring layer are embedded in the insulating layer. A recess portion is formed in an outer edge portion of the upper surface of the wiring layer, and the recess portion is filled with the insulating layer.
Inventors:
Hiroharu Yanagisawa
Kazuhiro Kobayashi
Kazuhiro Kobayashi
Application Number:
JP2016142613A
Publication Date:
April 28, 2020
Filing Date:
July 20, 2016
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
H05K1/02; H01L21/60; H01L23/12; H05K1/18; H05K3/18; H05K3/34; H05K3/38
Domestic Patent References:
| JP64082595A | ||||
| JP2007250925A | ||||
| JP2015050343A | ||||
| JP7015099A | ||||
| JP2011159688A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito