Title:
WIRING BOARD AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2021141177
Kind Code:
A
Abstract:
To provide a wiring board and a manufacturing method thereof that makes it possible for current to flow easily through wiring without making a wiring pattern area easy to see.SOLUTION: A wiring board 10 includes a transparent board 11 and a wiring pattern area 20 arranged on the board 11 and including a plurality of wirings 21. The wiring 21 has a recess 25 formed along the longitudinal direction of the wiring 21, and the recess 25 has a recess bottom surface 25a and two recess side surfaces 25b and 25c located on both sides of the recess bottom surface 25a.SELECTED DRAWING: Figure 6
Inventors:
KAWAGUCHI SHUJI
TAKE SEIJI
TAKE SEIJI
Application Number:
JP2020037077A
Publication Date:
September 16, 2021
Filing Date:
March 04, 2020
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
H05K1/02; H01P11/00; H01Q1/24; H05K3/12
Attorney, Agent or Firm:
Yukitaka Nakamura
Satoru Asakura
Yukihiro Hotta
Takuhisa Murata
Satoru Asakura
Yukihiro Hotta
Takuhisa Murata