METHOD FOR MANUFACTURING WIRING BOARD AND WIRING BOARD

Japanese Patent JP2023046974

A

To provide a method for manufacturing a wiring board, the method enabling formation of a fine metal pattern having high adhesibility, and a wiring board having high adhesibility of the metal pattern.SOLUTION: A method for manufacturing a wiring board is provided, including the steps of: forming a resin pattern on a board; applying a surface treatment agent including a compound α to the board on which the resin pattern has been formed; and forming a metal pattern by plating processing on the board to which the surface treatment agent has been applied. The compound α has a first functional group capable of reacting and binding with the board and a second functional group capable of reacting and binding with the metal.SELECTED DRAWING: Figure 1f

JP5327107	Manufacturing method for printed circuit boards, printed wiring boards, and printed wiring boards
JP2015057812	METHOD FOR MANUFACTURING PRINTED WIRING BOARD, LAMINATE USED FOR THE SAME, LAMINATE FILM, NON-CURABLE RESIN COMPOSITION, AND PRINTED WIRING BOARD OBTAINED BY THE MANUFACTURING METHOD
JP3324973	INDUSTRIAL APPLICABILITY: A method for manufacturing a positioning mark and a multilayer printed wiring board for forming a resist pattern.

SHIHO KOUJI
UCHIYAMA KATSUHIRO
MITSUDA KAZUHIRO
YASU KATSUHIKO
TAKAHASHI YUKI

JP2021155845A

April 05, 2023

September 24, 2021

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JSR CORP
HOKOSHA TECH CO LTD

H05K3/18; C23C18/20; G03F7/40; G03F7/42

Yoshinori Ikeda
Amano Kazunori
Katsumasa Fujimoto
Koji Ishida
Masako Matsuura

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