Title:
WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD
Document Type and Number:
Japanese Patent JP2014038890
Kind Code:
A
Abstract:
To improve strength of a wiring board.
The thickness of a base substrate 20 is formed larger compared to the thickness of a capacitor 70. Specifically, the thickness of the capacitor 70 is made to be approximately 0.5 of the thickness of the base substrate 20. The thickness of the base substrate 20 is thereby made to be around twice as much as the thickness of the capacitor 70. For this reason, the thickness of the base substrate 20 for housing the capacitor 70 is thicker enough compared to the thickness of the capacitor 70, and as a result, strength of a wiring board 10 improves.
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Inventors:
SHIMABE TOYOTAKA
SHIMIZU KEISUKE
FURUYA TOSHIKI
SHIMIZU KEISUKE
FURUYA TOSHIKI
Application Number:
JP2012178953A
Publication Date:
February 27, 2014
Filing Date:
August 10, 2012
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K3/46
Domestic Patent References:
| JP2003209201A | 2003-07-25 | |||
| JP2010226069A | 2010-10-07 | |||
| JP2002100875A | 2002-04-05 | |||
| JP2002359319A | 2002-12-13 |
Attorney, Agent or Firm:
Kimura Mitsuru
Koji Yashima
Takanori Mamoru
Naoki Yamaguchi
Takehiko Ishido
Koji Yashima
Takanori Mamoru
Naoki Yamaguchi
Takehiko Ishido