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Title:
WIRING BOARD, AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2010219513
Kind Code:
A
Abstract:

To provide a wiring board in which a proper substrate strength can be obtained and a feed-through electrode can be formed in a through-hole of a substrate with a high yield and production efficiency.

The wiring board includes a first substrate portion 5a formed from a wafer and including a first feed-through conductor portion 20 in a vertical direction, a second substrate portion 5b provided on the first substrate portion 5a and including a second feed-through conductor portion 40 in a vertical direction of a corresponding part to the first feed-through conductor portion 20, and the feed-through electrode TE is composed of the first feed-through conductor portion 20 and the second feed-through conductor portion 40. Substrates 10 and 30 of the first substrate portion 5a and second substrate portion 5b are made of silicon, silicon carbide or glass.


Inventors:
SAKAGUCHI HIDEAKI
SHIRAISHI AKINORI
HIGASHI MITSUTOSHI
Application Number:
JP2010032040A
Publication Date:
September 30, 2010
Filing Date:
February 17, 2010
Export Citation:
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Assignee:
SHINKO ELECTRIC IND CO
International Classes:
H01L23/12; H01L21/66; H01L23/14; G01R1/073
Domestic Patent References:
JP2008130934A2008-06-05
JP2006344725A2006-12-21
JP2004319758A2004-11-11
JP2008130934A2008-06-05
JP2006344725A2006-12-21
JP2004319758A2004-11-11
Attorney, Agent or Firm:
Keizo Okamoto



 
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