Title:
WIRING BOARD, AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2010258377
Kind Code:
A
Abstract:
To provide a wiring board capable of securing insulation between respective wiring layers in laminating wiring layers through insulators, and a method of manufacturing the same.
In this wiring board 10 including a first wiring layer 22 formed on a board 20, an insulator 31 for covering at least the first wiring layer 22, and a jumper wire 32 formed on the first wiring layer 22 through the insulator 31 and arranged to straddle the first wiring layer 22, the insulator 31 is formed by laminating a plurality of insulation layers 34, 35.
Inventors:
FUJITA HIROYUKI
ENDO KIYOHITO
MURAKAMI FUMIKAZU
ENDO KIYOHITO
MURAKAMI FUMIKAZU
Application Number:
JP2009109875A
Publication Date:
November 11, 2010
Filing Date:
April 28, 2009
Export Citation:
Assignee:
SEIKO INSTR INC
International Classes:
H05K1/11; H05K3/28; H05K3/40
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Tadashi Takahashi
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