Title:
WIRING BOARD
Document Type and Number:
Japanese Patent JP2002289994
Kind Code:
A
Abstract:
To provide a wiring board superior in productivity which effectively prevents the peel off of wiring conductors.
The wiring board having a glass layer 2 deposited to the upside of an insulation board 1 and a plurality of wiring conductors 3 deposited to the glass layer 2 comprises many trenches 1a approximately parallel underlying the wiring conductors 3, in the transverse direction on the upside of the board 1 and an air layer 4 between the inner surfaces of the trenches 1a and the glass layer 2.
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Inventors:
KIKUCHI MICHIMASA
Application Number:
JP2001090896A
Publication Date:
October 04, 2002
Filing Date:
March 27, 2001
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H05K1/02; H01L23/15; H05K3/12; (IPC1-7): H05K1/02; H01L23/15; H05K3/12