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Patent Searching and Data


Title:
WIRING BOARD
Document Type and Number:
Japanese Patent JP2004055963
Kind Code:
A
Abstract:

To provide a wiring board which can efficiently transmit high-frequency electrical signals of 30 GHz or higher to a wiring conductor.

This wiring board includes an insulating base 1 formed of an oxide sintered material containing an Si component of 25-80 mass% in terms of SiO2, a Ba component of 15-70 mass% in terms of BaO, a B component of 1.5-5 mass% in terms of B2O3, an Al component of 1-30 mass% in terms of Al2O3, and a Ca component of 0-30 mass% in terms of CaO, and a wiring conductor 2 formed on the base 1 and having a specific electrical resistance of 2.5 (μΩ cm) or smaller and the ruggedness of the outer surface of 50 μm or smaller.


Inventors:
OTOMARU HIDEKAZU
SATA AKIHITO
Application Number:
JP2002213591A
Publication Date:
February 19, 2004
Filing Date:
July 23, 2002
Export Citation:
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Assignee:
KYOCERA CORP
International Classes:
C04B35/14; H01L23/08; H01L23/13; H01L23/15; H05K1/03; (IPC1-7): H05K1/03; C04B35/14; H01L23/08; H01L23/13; H01L23/15