To provide a wiring board packaging in high density on the wiring board, while provided with the electric discharge pattern for discharging static electricity.

The wiring board 1 is provided with at least one pair of component mounting lands 3, 3 on the surface of a substrate body 2. A bottomed hole or penetrating hole 4 for forming a gap 6 for electrostatic discharge is provided in the substrate body, at the position just under the place where electronic parts are mounted in the pair of component mounting lands. A pair of electrodes 5, 5 for electric discharge opposing to each other via the gap for electrostatic discharge are provided, and wiring patterns 7, 7 for leading-out of electrodes are provided so that each of the pair of electrodes for electric discharge may be led out to the pair of component mounting lands for connecting electrically. The gap for electrostatic discharge is set as a gap shorter than the terminal electrode opposed interval of the electronic parts mounted in the pair of component mounting lands.