Title:
WIRING BOARD
Document Type and Number:
Japanese Patent JPH09186436
Kind Code:
A
Abstract:
To obtain a wiring board for enhancing the mounting efficiency of a mounter.
A specified conductor pattern 12 is formed of a conductive member on one surface of an insulating basic material 11 and a translucent film is formed on a positioning pattern 12B comprising a part of the conductor pattern 12. Since the image of positioning pattern 12B can be picked up surely by means of a camera, a mounter can position a wiring board 10 easily. Consequently, the mounting efficiency of mounter can be enhanced.
Inventors:
SASAKI TAKAHIDE
Application Number:
JP35178295A
Publication Date:
July 15, 1997
Filing Date:
December 27, 1995
Export Citation:
Assignee:
SONY CORP
International Classes:
H05K13/04; H05K3/28; (IPC1-7): H05K3/28
Attorney, Agent or Firm:
Kei Tanabe