Title:
配線基板、フィルタデバイスおよび携帯機器
Document Type and Number:
Japanese Patent JP5356520
Kind Code:
B2
Abstract:
In a wiring substrate, a wiring layer includes a pair of differential transmission lines. A conductive layer is provided on one side of the wiring layer. The conductive layer is grounded. An insulating layer is provided between the wiring layer and the conductive layer. The conductive layer includes a region, formed by an electrically continuous conductor, within a filter region. At least part of the conductor is turned around in the region. Seen from a stacking direction, the pair of differential transmission lines intersects with at least two strip portions disposed counter to each other because of the turning-around of the electrically continuous conductor.
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| JP3954641 | Differential transmission line |
| JP3741603 | WIRING STRUCTURE AND WIRING BOARD |
Inventors:
Yasuhiro Kaizaki
Application Number:
JP2011515755A
Publication Date:
December 04, 2013
Filing Date:
September 30, 2009
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
International Classes:
H01P3/04; H01F17/00; H01F19/00
Domestic Patent References:
| JP2012074901A | 2012-04-12 | |||
| JPH11307392A | 1999-11-05 | |||
| JP2009088329A | 2009-04-23 | |||
| JP2005038900A | 2005-02-10 |
Attorney, Agent or Firm:
Sakaki Morishita
Satoshi Soda
Satoshi Soda
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