Title:
配線体、配線基板、及びタッチセンサ
Document Type and Number:
Japanese Patent JP6518759
Kind Code:
B2
Abstract:
A wiring body (40) includes: a first conductor layer (60); a second conductor layer (80); and a second resin layer (70) interposed between the first and second conductor layers (60, 80). The first conductor layer (60) includes at least: a first electrode (61); a first lead wire (62) electrically connected to the first electrode (61); and a first shield layer (63) electrically insulated from the first electrode (61) and the first lead wire (62). The second conductor layer (80) includes at least: a second electrode (81) disposed to face the first electrode (61); and a second lead wire (82) electrically connected to the second electrode (82). The first electrode (61), the first lead wire (62), and the first shield layer (63) are formed on substantially same plane. The second electrode (81) and the second lead wire (82) are formed on substantially same plane. At least a part of the second lead wire (82) overlaps the first shield layer (63) in a plan view. The first conductor layer (60) includes a noncontact surface (613, 621, 631) that is not in contact with the second resin layer (70). The first conductor layer (60) is embedded in the second resin layer (80) except the noncontact surface (613, 621,631). The second conductor layer (80) is provided on the second resin (80). The first shield layer (63) includes a shield line (631). The shield line (631) has a tapered shape that narrows toward a side approaching the second lead wire (82). The second lead wire (82) has a tapered shape that narrows toward a side departing from the shield line (631).
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Inventors:
Shingo Ogura
Application Number:
JP2017502520A
Publication Date:
May 22, 2019
Filing Date:
February 26, 2016
Export Citation:
Assignee:
Fujikura Ltd.
International Classes:
G06F3/041; G06F3/044; H05K1/02
Domestic Patent References:
| JP7169635A | ||||
| JP2012203565A | ||||
| JP2006302930A | ||||
| JP2014071863A | ||||
| JP2013171864A | ||||
| JP2012168301A | ||||
| JP2014191717A | ||||
| JP4436441B2 | ||||
| JP2014056461A |
Foreign References:
| US20140307178 |
Attorney, Agent or Firm:
Eternal patent business corporation