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Patent Searching and Data


Title:
WIRING CLIP AND USAGE OF WIRING CLIP
Document Type and Number:
Japanese Patent JP2011114890
Kind Code:
A
Abstract:

To provide a wiring clip and a method of using the wiring clip favorably applicable to a machine, such as a desk-top label printer using a thin electric wire (wire).

The wiring clip 1 includes a first clip body 2 obtained by laminating an elastic member 5 and an adhesive clamping surface 6 in this order on one side of a first base material 4 expanded into a plate and a second clip body 3 obtained by laminating an elastic member 10 and an adhesive clamping surface 11 in this order over one side of a second base material 9 expanded into a plate. The wiring clip is formed by overlapping and sticking together the adhesive clamping surfaces 6, 11 of the first and second clip bodies so that they can be peeled off from each other. An electric wire can be clamped and supported between the adhesive clamping surfaces of the first and second clip bodies 2, 3.


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Inventors:
KOO SU PEI
Application Number:
JP2009266929A
Publication Date:
June 09, 2011
Filing Date:
November 25, 2009
Export Citation:
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Assignee:
SATO KNOWLEDGE & IP INST
SATO KK
International Classes:
H02G3/30; F16B11/00; H05K7/00
Domestic Patent References:
JPS5773982U1982-05-07
JPH1161080A1999-03-05
JPH09147630A1997-06-06
JPS577822U1982-01-16
JPS54161619U1979-11-12
JP2009136121A2009-06-18
JP2005179420A2005-07-07