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Patent Searching and Data


Title:
WIRING CONNECTING STRUCTURE AND WIRING CONNECTING METHOD
Document Type and Number:
Japanese Patent JPH10199456
Kind Code:
A
Abstract:

To reliably perform the formation of a grid and wiring connection between the grid and a wiring conductor on a base board without causing connection failure.

A grid wiring pattern 5 of a prescribed pattern shape is formed on an anode base board 2, and an insulating layer 7 having a through hole 6b is formed on the anode base board 2 so that the grid wiring pattern 5 faces to a wiring place. The through hole 6b is filled with a conductive material 28, and a frame-shaped grid connecting rib 27 is printed and formed on the insulating layer 7 so as to surround the conductive material 28 on the through hole 6b. The grid connecting rib 27 is integrally connected to a rib to form a display pattern through a simultaneously printed-formed deriving rib 16. Conductive paste is integrally printed and formed on top upper surfaces 16a and 27a of the respective ribs 16 and 27 and in a frame 27b of the grid connecting rib 27. Therefore, the formation of a grid 31 and electric connection between the grid 31 and a grid wiring conductor 29 are performed at a time.


Inventors:
OKAMOTO YOSHINARI
SUZUKI TOSHINORI
KATO MASAHIRO
MUTO SHIGEO
TORIGOE YUICHI
Application Number:
JP227597A
Publication Date:
July 31, 1998
Filing Date:
January 09, 1997
Export Citation:
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Assignee:
FUTABA DENSHI KOGYO KK
International Classes:
H01J9/24; H01J9/14; H01J9/28; H01J29/86; H01J29/90; H01J31/15; H01J37/02; (IPC1-7): H01J31/15; H01J9/24; H01J9/28; H01J29/86; H01J29/90
Attorney, Agent or Firm:
Nishimura Norimitsu