Title:
WIRING CONNECTION STRUCTURE FOR ELECTRONIC CIRCUIT SEALING MEMBER
Document Type and Number:
Japanese Patent JP3497436
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To miniaturize a connector housing in a wiring connection structure for an electronic circuit sealing member by holding an electrical element sealing members in a connector housing without forming a storable opening by inserting the electrical element sealing member in the connector housing.
SOLUTION: An abutting surface 8 is provided on the end face with terminals 2 of an electronic circuit sealing member 1, an abutting surface 9 of a connector housing 3a is provided on the end face that corresponds to the surface 8. A pair of projections 13 for engagement are provided on both sides of the abutting surface 8 of the member 1 in parallel to the insertion direction to the connector 3, and the projection for locking 11 is provided for each of the projection 13. Engaging recesses 34 matching the projections 13 are provided on both sides of the abutting surface 9 of the housing 3a, and holes 31 for locking that match the projections 11 are provided on the upper surface of the housing 3a.
Inventors:
Yasunori Odakura
Application Number:
JP2000050030A
Publication Date:
February 16, 2004
Filing Date:
February 25, 2000
Export Citation:
Assignee:
株式会社日立製作所
株式会社日立カーエンジニアリング
株式会社日立カーエンジニアリング
International Classes:
H01R12/16; H01R12/04; H01R12/22; (IPC1-7): H01R12/22
Domestic Patent References:
| JP8180911A | ||||
| JP6433179U | ||||
| JP273072U | ||||
| JP5649076U |
Attorney, Agent or Firm:
Kasuga