Title:
配線形成方法
Document Type and Number:
Japanese Patent JP4013308
Kind Code:
B2
Abstract:
A wiring pattern forming method includes the step of: forming resist patterns on an aluminum or aluminum alloy conductive layer, the resist patterns including a low density pattern area and a high density pattern area; etching and removing a portion of a thickness of the conductive layer by an etching process presenting anti-microloading effect by using the resist patterns as an etching mask, and etching and removing another portion of the thickness of the conductive layer by an etching process presenting microloading effect by using the resist patterns as an etching mask. A method of forming an aluminum or aluminum alloy wiring pattern is provided which can maintain a high etching rate and reduce electron shading damage.
Inventors:
Tahara Jie
Application Number:
JP988198A
Publication Date:
November 28, 2007
Filing Date:
January 21, 1998
Export Citation:
Assignee:
Yamaha Corporation
International Classes:
H01L21/302; H01L21/3065; H01L21/3213; H01L21/027
Domestic Patent References:
| JP6163479A | ||||
| JP8340005A | ||||
| JP8181138A | ||||
| JP9266211A | ||||
| JP7094469A | ||||
| JP58154232A |
Attorney, Agent or Firm:
Keishiro Takahashi
Mikio Kuruyama
Mikio Kuruyama