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Patent Searching and Data


Title:
WIRING INSPECTION METHOD FOR PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH07260861
Kind Code:
A
Abstract:

PURPOSE: To provide a method for inspecting the wiring of a printed wiring board(PWB) in which the inspection time is shortened while reducing the cost of inspection jigs regardless of the quantity or type of the PWB to be inspected and even a high density wiring can be inspected with high accuracy.

CONSTITUTION: Conduction of wiring between predetermined points is inspected using an electrode unit 1 comprising a flexible inspection sheet electrode 2 applied with a wiring 8 having connection points 6 touching the inspection points 5 on a PWB A, and a frame type plate electrode 4 which can be connected on a wiring 14 and a lead wire 15 with the measuring section of an inspection equipment through or not through an interconnecting sheet electrode 3. Furthermore, a reference sheet electrode provided with reference points corresponding to all reference grid points of the PWB A and peripheral points corresponding to the electrode points on the plate electrode is interposed between the inspection sheet electrode 2 and the plate electrode 4.


Inventors:
SOUMA TAKANORI
Application Number:
JP5241294A
Publication Date:
October 13, 1995
Filing Date:
March 24, 1994
Export Citation:
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Assignee:
SOUMA GIKEN KK
International Classes:
G01R31/02; H05K1/02; (IPC1-7): G01R31/02; H05K1/02
Attorney, Agent or Firm:
Dozo Isono