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Patent Searching and Data


Title:
WIRING STRUCTURE FOR FLOOR HEATING
Document Type and Number:
Japanese Patent JPH09317143
Kind Code:
A
Abstract:

To improve heating efficiency by a method wherein floor heating panels each equipped with a floor heating heater at the inside and a connecting part for a service wire at its one end are arranged side by side to form a floor heating panel body, and a wiring panel is provided at the end of the panel body.

A tieplate-like floor heating panel 2 is formed with an indent subsiding toward the downside provided at its one end and a service wire connecting part 1 for housing a connector and a plug provided at the inside of the indent. Then, a floor heating panel body 3 is formed with a plurality of paired floor heating panels 2 each butted against each other at their other ends arranged side by side. Wiring panels 4 are arranged at the side of the floor heating panels 2 so that the floor heating panel body 3 is sided by the wiring panels, and the service wire connecting parts 1 are connected with one another in series with a wiring 8 through the wiring panels 4. Therefore, an extended continuous heating surface can be formed efficiently without sparing unheated areas.


Inventors:
MURATA HIDETAKA
Application Number:
JP13393196A
Publication Date:
December 09, 1997
Filing Date:
May 28, 1996
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
E04F15/18; F24D13/02; H02G3/38; (IPC1-7): E04F15/18; F24D13/02; H02G3/28
Attorney, Agent or Firm:
石田 長七 (外2名)