Title:
WIRING STRUCTURE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2005191540
Kind Code:
A
Abstract:
To realize a highly reliable multi-layer wiring structure capable of preventing an operation failure even under high temperature environments.
A first wiring 102A and a second wiring 111 are connected through a via 110A formed in an interlayer dielectric (SiO2 film 104 and FSG film 105). A dummy via 110B is connected to the second wiring 111 at the vicinity of the connection part of the via 110A and the second wiring 111. The dummy via 110B does not form a part of a closed circuit during actual use.
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Inventors:
HARADA TAKASHI
Application Number:
JP2004304019A
Publication Date:
July 14, 2005
Filing Date:
October 19, 2004
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L23/52; H01L21/31; H01L21/3205; H01L21/4763; H01L21/768; H01L21/822; H01L23/48; H01L23/522; H01L23/532; H01L27/04; H01L29/40; (IPC1-7): H01L21/3205; H01L21/768; H01L21/822; H01L27/04
Attorney, Agent or Firm:
Hiroshi Maeda
Hiroshi Koyama
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Hiroshi Koyama
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori