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Patent Searching and Data


Title:
WIRING STRUCTURE, AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2008311305
Kind Code:
A
Abstract:

To provide a wiring structure capable of performing a pattern shape management highly precisely by suppressing the influence of a lower-layer structure, and to provide a manufacturing method thereof.

Disclosed is the wiring structure that has a wiring pattern 118 formed on an insulating film 111 on a substrate, a measurement pattern 119 formed in a different region of the insulating film 111 on the substrate 1 from the wiring pattern 118 and irradiated with measurement light, and a light transmission suppression film 109 formed right below the measurement pattern 119, the wiring structure being characterized in that the measurement pattern 119 and wiring pattern 118 are the same pattern and the light transmission suppression film 109 has smaller light transmittance than the material of the insulating film 111 constituting the measurement pattern 119.


Inventors:
TAMURA KOJI
Application Number:
JP2007155524A
Publication Date:
December 25, 2008
Filing Date:
June 12, 2007
Export Citation:
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Assignee:
SHARP KK
International Classes:
H01L21/66; H01L21/3205; H01L21/82; H01L21/822; H01L23/52; H01L27/04
Domestic Patent References:
JP2006108579A2006-04-20
JP2005030822A2005-02-03
JP2002280429A2002-09-27
JP2000012638A2000-01-14
JP2004158478A2004-06-03
Attorney, Agent or Firm:
Shintaro Nogawa