Title:
配線構造
Document Type and Number:
Japanese Patent JP7010860
Kind Code:
B2
Abstract:
A wiring structure includes: multiple wiring modules configured to be installed on a rail that extends in a predetermined first direction, so as to be adjacent to one another along the rail by being placed on the rail from the side of a second direction orthogonal to the first direction; an IO unit configured to be attached to the plurality of wiring modules from the second direction side to thereby be electrically connected to the multiple wiring modules. In each of the multiple wiring modules, a lead wire extending in a third direction that intersects the first direction and the second direction, from a first face of the wiring module that lies on the third direction side, is connected to the wiring module.
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| JPH01209675 | TERMINAL DEVICE |
Inventors:
Akiki Sato
Application Number:
JP2019019685A
Publication Date:
February 10, 2022
Filing Date:
February 06, 2019
Export Citation:
Assignee:
FANUC Corporation
International Classes:
H01R9/22; H02G3/30; H05K7/12
Domestic Patent References:
| JP2000215931A | ||||
| JP4048671U | ||||
| JP5062726A | ||||
| JP2001217016A |
Attorney, Agent or Firm:
Takehiro Chiba
Toshiyuki Miyadera
Takayuki Chima
Yasuharu Nakasone
Shiro Sakai
Tosuke Sekiguchi
Toshiyuki Miyadera
Takayuki Chima
Yasuharu Nakasone
Shiro Sakai
Tosuke Sekiguchi