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Title:
WIRING TERMINAL CONNECTING APPARATUS
Document Type and Number:
Japanese Patent JP2013114963
Kind Code:
A
Abstract:

To provide a wiring terminal connecting apparatus which can surely perform overlapping and joining a wiring plate-like member to a main wiring board so as to face closely with superior workability, and can facilitate confirming that overlapping and joining the wiring plate-like member to the main wiring board is surely performed so as to face closely.

The wiring terminal connecting apparatus includes: a substrate side connector 12 which has an insulation housing 15 fixed on a main wiring board 11; and a plate-like member side connector 14 which has a contact 18 connected to a wiring plate-like member 13 and an engaging part 21 engaged with the substrate side connector 12. A contact 16 of the substrate side connector 12 has a contact engagement part 29 which protrudes from an outer peripheral surface part of the insulation housing 15. The engaging part 21 of the plate-like member side connector 14 forms a fitting hole which is fitted into the outer periphery of the insulation housing 15. A contact connection part 25 of the contact 18 is arranged around the fitting hole. When the fitting hole is fitted into the outer periphery of the insulation housing 15, the contact connection part 25 is brought into contact with and is connected with the contact engagement part 29.


Inventors:
HIRAKAWA TAKESHI
Application Number:
JP2011261517A
Publication Date:
June 10, 2013
Filing Date:
November 30, 2011
Export Citation:
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Assignee:
DAIICHI SEIKO CO LTD
International Classes:
H01R12/73
Domestic Patent References:
JP2001035571A2001-02-09
JP2002319441A2002-10-31
JPH05226040A1993-09-03
JP2011065861A2011-03-31
Attorney, Agent or Firm:
Sadaaki Kamihara