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Patent Searching and Data


Title:
WOOD BOARD HAVING MILDEW RESISTANCE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2002036215
Kind Code:
A
Abstract:

To provide a wood board emitting a small amount of formaldehyde and having an excellent mildew resistance.

A wood board such as an intermediate duty fiber board, a particle board and the like is obtained by adding 3-iodine-2-propynyl butyl carbamate being an organic iodine based mildew-proofing agent to an adhesive emitting a small amount of formaldehyde, mixing the resulting adhesive with wood fiber or wood sliced sheet piece and forming the mixture by hot pressing. The board emits only a small amount of formaldehyde and has excellent mildew resistance.


Inventors:
FUKUDA KATSUNOBU
HAGIO KATSUHIKO
Application Number:
JP2000230857A
Publication Date:
February 05, 2002
Filing Date:
July 31, 2000
Export Citation:
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Assignee:
SUMITOMO FORESTRY
SHINTO FINE CO LTD
International Classes:
B27K3/34; B27N3/02; B27N3/08; (IPC1-7): B27N3/02; B27K3/34; B27N3/08
Attorney, Agent or Firm:
Akira Asamura (3 outside)