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Patent Searching and Data


Title:
WOOD CHIP CEMENT MOLDING, WOOD CHIP ADHESION MOLDING, WOOD-LIKE MOLDING AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH11129223
Kind Code:
A
Abstract:

To provide a wood chip cement molding, a wood chip adhesion molding, a wood-like molding and their manufacturing methods, which is laboursaving and has a favorable efficiency, by a method wherein a mixing process and a grinding process are made into one line by mixing an then grinding recovered woody members and recovered resin members and consequently the space-saving in a factory can be contrived.

The manufacturing method of this wood-like molding is performed by employing ground powder obtained from recovered building members. The building members are equipped with recovered wooden members made of wood and recovered resin members made of resin. Further, a mixing process for mixing the recovered wooden members and the recovered resin members, a grinding process for forming ground powder by grinding the mixture in the mixing process, a kneading process for kneading the ground powder obtained in the grinding process and a molding process for molding the powder kneaded in the kneading process through extrusion or injection molding are equipped.


Inventors:
TAGUCHI HIDENORI
UMEMURA KEISHIRO
Application Number:
JP29971897A
Publication Date:
May 18, 1999
Filing Date:
October 31, 1997
Export Citation:
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Assignee:
MISAWA HOMES CO
International Classes:
B27N1/00; B27N3/00; B27N3/28; B27N5/00; B29B13/10; B29C45/17; B29C47/08; C04B18/16; C04B18/26; C04B28/02; C08L1/02; (IPC1-7): B27N1/00; B27N3/28; B29B13/10; C04B18/16; C04B28/02
Attorney, Agent or Firm:
Hiromichi Kuroda (4 outside)