Title:
WOOD FLOUR-CONTAINING RESIN COMPOSITION AND FLEXIBLE WOODY RESIN MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2004155955
Kind Code:
A
Abstract:
To provide a wood flour-containing resin composition which gives a highly flexible woody resin molded product using a chlorine-free resin component.
The wood flour-containing resin composition comprises 100pts.wt. of a propylene polymer composition comprising a non-crystalline polypropylene and/or propylene copolymer and a crystalline polypropylene and/or propylene copolymer and 20-200pts.wt. of wood flour having an average particle size within the range of 10-1,000μm. The woody resin molded product is a cured product of the wood flour-containing resin composition.
Inventors:
TAGA TAKEFUMI
NAGAYASU ISAO
SUZUKI KOJI
NAGAYASU ISAO
SUZUKI KOJI
Application Number:
JP2002324192A
Publication Date:
June 03, 2004
Filing Date:
November 07, 2002
Export Citation:
Assignee:
UBE INDUSTRIES
MISAWA HOMES CO
MISAWA HOMES CO
International Classes:
C08J5/00; C08L23/10; C08L97/02; C08L101/00; (IPC1-7): C08L23/10; C08J5/00; C08L97/02; C08L101/00
Attorney, Agent or Firm:
Yanagawa Yasuo