Title:
木質ボード及びその製造方法
Document Type and Number:
Japanese Patent JP7300472
Kind Code:
B2
Abstract:
To improve strength of a woody board without using MDI.SOLUTION: According to a woody board made by molding an adhesive agent additive material into a plate shape, the material in which an adhesive agent for bonding woody constituent materials to each other is added into the woody constituent materials; the adhesive agent comprises a mixture of a urea resin-based adhesive agent, a melamine resin-based adhesive agent or a urea-melamine co-condensation resin-based adhesive agent with a polyamide-epichlorohydrin resin.SELECTED DRAWING: None
Inventors:
Tatsuya Yamashita
Tomoya Shimoda
Takeshi Fukaya
Nobuo Kawabe
Tomoya Shimoda
Takeshi Fukaya
Nobuo Kawabe
Application Number:
JP2021028927A
Publication Date:
June 29, 2023
Filing Date:
February 25, 2021
Export Citation:
Assignee:
Daiken Industry Co., Ltd.
International Classes:
B27N3/02; C09J161/24; C09J161/28; C09J177/00
Domestic Patent References:
| JP2018203821A | ||||
| JP2020521651A | ||||
| JP2011501771A | ||||
| JP2018202654A |
Foreign References:
| CN110713581A | ||||
| US20130190428 | ||||
| CN110819276A |
Attorney, Agent or Firm:
Patent Attorney Corporation Maeda Patent Office