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Title:
WOODY BOARD
Document Type and Number:
Japanese Patent JP2014151599
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide, by targeting a woody board using woody chips or woody fibers, a woody board having a high dimensional stability by inhibiting dimensional variations accompanying humidity absorption and release.SOLUTION: The provided woody board molded by adhering woody chips or woody fibers via an adhesive includes soft cell-removed bamboo fibers 12 obtained by removing soft cells from bamboo fibers 11 provided by pulverizing a bamboo 10.

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Inventors:
MORITA SEISHI
ASADA TEPPEI
Application Number:
JP2013024943A
Publication Date:
August 25, 2014
Filing Date:
February 12, 2013
Export Citation:
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Assignee:
PANASONIC CORP
International Classes:
B27N3/00; B27N3/04
Attorney, Agent or Firm:
Toshio Nishizawa



 
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