Title:
WORK CUTTING DEVICE AND WORK CUTTING METHOD
Document Type and Number:
Japanese Patent JP2002264002
Kind Code:
A
Abstract:
To provide a work cutting device capable of suppressing unevenness of assembling accuracy caused by a foreign matter adhering to a contact face between a cutter blade and a spacer when reassembling the work cutting device.
This cutting device has the rotary blades 2, 4, 6; and the spacers 3, 5 fixed to the rotary blades 2, 4, 6 with the spacers 3, 5 contacted with the rotary blades 2, 4, 6, having grooves 3a, 5a for storing the foreign matter formed in faces contacting with the rotary blades 2, 4, 6.
Inventors:
SAKAI KANEHITO
SAKUMICHI HIDETAKA
SAKUMICHI HIDETAKA
Application Number:
JP2001064387A
Publication Date:
September 18, 2002
Filing Date:
March 08, 2001
Export Citation:
Assignee:
SUMITOMO SPEC METALS
International Classes:
B24B27/06; H01L21/301; (IPC1-7): B24B27/06; H01L21/301
Domestic Patent References:
JPH05299501A | 1993-11-12 | |||
JPH024686A | 1990-01-09 | |||
JP2000104745A | 2000-04-11 | |||
JPS6075008U | 1985-05-25 |
Attorney, Agent or Firm:
Hirokazu Miyazono
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