To prevent the deformation of a cut article by blowing cooling air against a work during the cutting to suppress the heat generation and to prevent the deformation of the work.

A working solution 5 containing the abrasive grain is sprayed from a nozzle 6 between a semi-conductor ingot 4 and a wire 2 while feeding the wire 2 in its longitudinal direction, and the semi-conductor ingot 4 is sliced by the lapping effect to form a wafer. The semi-conductor ingot 4 is cooled by blowing cooling air 8 against the semi-conductor ingot 4 during the slicing from an air nozzle 7, and the heat generation of the semi-conductor ingot 4 during the machining is suppressed to achieve the machining with excellent accuracy. The deformation of the semi-conductor ingot 4 during the slicing is prevented, and the deformation of a wafer which is a sliced article, can be prevented thereby.