Title:
ワークの切断方法、シリコン単結晶の切断方法およびシリコンウェーハの製造方法
Document Type and Number:
Japanese Patent JP6635024
Kind Code:
B2
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Inventors:
Toshiro Kotooka
Application Number:
JP2016252459A
Publication Date:
January 22, 2020
Filing Date:
December 27, 2016
Export Citation:
Assignee:
Sumco inc.
International Classes:
H01L21/304; C30B29/06
Domestic Patent References:
| JP2005028620A | ||||
| JP2004214588A | ||||
| JP63084878A | ||||
| JP2003212692A |
Foreign References:
| WO2005037509A1 |
Attorney, Agent or Firm:
Intellectual Property Office