Title:
WORK-PIECE HOLDER AND WORK-PIECE DESORPTION METHOD
Document Type and Number:
Japanese Patent JP2019055436
Kind Code:
A
Abstract:
To provide a work-piece holder which can desorb a wafer, in which a half-cut groove is formed, from a chuck table which constitutes holding means.SOLUTION: A work-piece holder is configured from holding means 20 for holding a work-piece 10, and control means 100 for controlling desorption of the work-piece in the holding means. The holder comprises: a suction source 30 which is connected to a frame body 22b via a first valve V1; a water supply source 40 which is connected to the frame body via a second valve V2 and supplies water; and a fluid supply source 50 which is connected to the frame body via s third valve V3, and supplies a fluid which contains a gas. When prescribed processing of the work-piece is performed, the control means opens the first valve, and sucks and holds the work-piece in a holding region, then, closes the first valve and opens the second valve, communicates the holding region with the water supply source, and supplies water to the holding region, thereby floating the work-piece from the holding region, and thereafter, opens the third valve, and supplies the fluid, which contains a gas, to the holding region, thereby alleviating surface tension of water.SELECTED DRAWING: Figure 1
Inventors:
SEKIYA KAZUMA
Application Number:
JP2017180122A
Publication Date:
April 11, 2019
Filing Date:
September 20, 2017
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B23Q3/08; H01L21/683
Domestic Patent References:
| JP2011091246A | 2011-05-06 | |||
| JP2001313326A | 2001-11-09 | |||
| JP2001093864A | 2001-04-06 | |||
| JPS6333907U | 1988-03-04 | |||
| JPH04267540A | 1992-09-24 | |||
| JP2003007653A | 2003-01-10 | |||
| JP2015115574A | 2015-06-22 |
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Kojino Koji
Yoshifumi Kaneko
Sachiko Okunuki
Kojino Koji
Yoshifumi Kaneko