Title:
ワーク加工機
Document Type and Number:
Japanese Patent JP4391545
Kind Code:
B2
Abstract:
A laser machining apparatus is capable of improving workpiece machining precision. The laser machining apparatus has a movable table for supporting a workpiece to be machined, and a camera for detecting the position of the workpiece by reflection light from an alignment mark formed through the workpiece. The apparatus also includes a jig plate provided between the table and the workpiece, and has light-receiving holes that overlap with the alignment mark (through-hole) and that are larger than the alignment mark (through hole).
Inventors:
Kaoru Matsumura
Fumiaki Kimura
Fumiaki Kimura
Application Number:
JP2007095001A
Publication Date:
December 24, 2009
Filing Date:
March 30, 2007
Export Citation:
Assignee:
Hitachi Via Mechanics, Ltd.
International Classes:
B23Q17/24; B23K26/02
Domestic Patent References:
| JP1095889A | ||||
| JP7132405A |
Attorney, Agent or Firm:
Kazuo Chikajima