Title:
WORKPIECE MACHINING DEVICE AND WORKPIECE MACHINING METHOD
Document Type and Number:
Japanese Patent JP2005324287
Kind Code:
A
Abstract:
To provide a workpiece machining device capable of improving machining quality and machining efficiency by suppressing the vibration of a rotary main spindle when a workpiece is machined.
The workpiece machining device machines the surface of the workpiece by relatively moving a machining tool and the workpiece 10. The device is provided with the rotatable rotary main spindle 3, a rotary table 9 to which the workpiece 10 is mounted and which is mounted to the end face 3a of the rotary main spindle 3 in a state that the rotation center 9a is deviated by a prescribed amount to the rotational axis 3b of the rotary main spindle 3, and a mounting means 8 for mounting a balance weight to the rotary main spindle 3.
Inventors:
NAKAGAWA HIROKI
Application Number:
JP2004144575A
Publication Date:
November 24, 2005
Filing Date:
May 14, 2004
Export Citation:
Assignee:
OLYMPUS CORP
International Classes:
B23Q17/12; B23B3/12; B23B5/00; (IPC1-7): B23B5/00; B23B3/12; B23Q17/12
Domestic Patent References:
JP358335Z | ||||
JPH02224944A | 1990-09-06 | |||
JPH11320333A | 1999-11-24 |
Attorney, Agent or Firm:
Takeji Nara
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