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Title:
WORKPIECE POLISHING METHOD AND POLISHING LIQUID
Document Type and Number:
Japanese Patent JP2014037052
Kind Code:
A
Abstract:

To provide a rolling element manufacturing method capable of suppressing uneven coloring and glossiness on a surface, sufficiently removing damage generated during preprocessing of workpiece manufacturing, and efficiently obtaining a member of low surface roughness, a workpiece polishing method, polishing liquid, and a polishing device.

For workpiece polishing, abrasive grains including particles made of photocatalysts and having particle sizes of 140 to 550 nm, a fluorescent material, and a substance transmitting light to excite the photocatalyst and the fluorescent material, and solvents are used. A rolling element workpiece polishing device 1 includes a disk-like workpiece support part 20 for swingably supporting a workpiece W, and a disk-like polishing pad 30 disposed to be slid into contact with the surface of the workpiece W supported by the workpiece support part 20, and configured to polish the surface of the workpiece W via polishing liquid while being relatively rotated around a center axis with respect to the workpiece support part 20 to rotate the workpiece W.


Inventors:
TANAKA TAKESHI
Application Number:
JP2013171429A
Publication Date:
February 27, 2014
Filing Date:
August 21, 2013
Export Citation:
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Assignee:
RITSUMEIKAN
International Classes:
B24B37/02; B24B37/00; B24B37/24; B24B37/26; C09G1/02; C09K3/14
Domestic Patent References:
JP2008307659A2008-12-25
JP2008307659A2008-12-25
Attorney, Agent or Firm:
Patent Business Corporation Suncrest International Patent Office



 
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