Title:
作業場の解体処理方法
Document Type and Number:
Japanese Patent JP7157983
Kind Code:
B2
Abstract:
To suppress diffusion of PCB to the surroundings from a PCB pollutant, concerning a processing method of a pollutant polluted by PCB, and a workplace dismantling method.SOLUTION: A coating film having a laminated structure of two or more layers is formed on the surface of a PCB pollutant, and the first layer in contact with the PCB pollutant is formed by a coating method for bringing a coating member into contact with a pollutant surface.SELECTED DRAWING: Figure 1
Inventors:
Yukihiro Goto
Masahiro Ogura
Yoshimizu Shimizu
Tadao Matsumoto
Yuta Nishimura
Yohei Watanabe
Yukari Sekiguchi
Masahiro Ogura
Yoshimizu Shimizu
Tadao Matsumoto
Yuta Nishimura
Yohei Watanabe
Yukari Sekiguchi
Application Number:
JP2019060580A
Publication Date:
October 21, 2022
Filing Date:
March 27, 2019
Export Citation:
Assignee:
Shinko Environmental Solution Co., Ltd.
Dyeing q Technology Co., Ltd.
Dyeing q Technology Co., Ltd.
International Classes:
B09B5/00; B05D1/36; B05D7/00
Domestic Patent References:
| JP2012187456A |
Foreign References:
| US20190017986 |
Attorney, Agent or Firm:
Fujimoto Partners Corporation
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