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Title:
WOUND ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2014007186
Kind Code:
A
Abstract:

To provide a wound electronic component inductance of which can be enhanced and adjusted by magnetizing a core composed of a magnetic material, without requiring any extra dedicated process or facility for magnetization, and mass productivity of which can be maintained by suppressing prolongation of lead time, and to provide a manufacturing method therefor.

The manufacturing method for a wound electronic component 1 includes a step for molding a core 2 composed of a magnetic material having a core part 3 and flanges 4, 5 provided at both ends thereof, a step for winding a conductive wire 6 around the core part 3, a step for forming at least a pair of electrodes 7a, 7b in the flanges 4, 5, and a connection step for connecting the wire ends 6a, 6b electrically with the electrodes 7a, 7b by a pulse heat system using a heater chip 21. In the connection step, when connecting the wire ends 6a, 6b with the electrodes 7a, 7b, the core 2 is magnetized utilizing a magnetic field H generated by a current I flowing through the heater chip 21.


Inventors:
UGAWA YOSHIAKI
Application Number:
JP2012139797A
Publication Date:
January 16, 2014
Filing Date:
June 21, 2012
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
International Classes:
H01F41/10; H01F13/00; H01F17/04; H01F41/04