Title:
WOVEN GLASS CLOTH SUBSTRATE AND LAMINATED BOARD PRODUCED BY USING THE MATERIAL
Document Type and Number:
Japanese Patent JPH06173166
Kind Code:
A
Abstract:
PURPOSE: To prepare a laminated board having high heat-resistance durable to the severe thermal condition applied in the automatic insertion of IC, etc., and to prepare a woven glass cloth substrate enabling the production of the laminated board.
CONSTITUTION: This woven glass cloth substrate is surface-coated with a silane- coupling agent and a compound having a molecular structure containing a benzene ring substituted with hydroxyl group, sulfone group and carboxyl group in separated state or in mixed state. The laminated board is produced by using the woven cloth substrate as a reinforcing material.
Inventors:
ISHIDA TETSUYA
MIYASATO KEITA
MURAKOSHI SUKEJI
MIYASATO KEITA
MURAKOSHI SUKEJI
Application Number:
JP31268892A
Publication Date:
June 21, 1994
Filing Date:
October 29, 1992
Export Citation:
Assignee:
NITTO BOSEKI CO LTD
International Classes:
B32B27/02; C03C25/10; D03D15/12; D06M13/02; D06M13/152; D06M13/244; D06M13/248; D06M13/256; D06M13/50; D06M13/51; D06M13/513; D06M101/00; H05K1/03; (IPC1-7): D06M13/513; B32B27/02; C03C25/02; D03D15/12; D06M13/256
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