To nondestructively inspect a position or a shape of a light-element foreign substance on the inside of a resin-sealed electronic component.

An X-ray imaging apparatus 1 is provided with an X-ray source 16, an X-ray interferometer 7 having a first crystal 2, a second crystal 4 and a third crystal 6, and an X-ray detector 20, wherein a first light-condensing zone plate 26 and a first light-collimating zone plate 28 making a pair, are disposed on the optical path of a first beam and between the first crystal 2 and the second crystal 4, or in between the second crystal 4 and the third crystal 6; and a second light-condensing zone plate 30 and a second light-collimating zone plate 32 which make another pair, are disposed on the optical path of a second beam and between the first crystal 2 and the second crystal 4 or between the second crystal 4 and the third crystal 6.