Title:
The adhesive composition for a dry lamination
Document Type and Number:
Japanese Patent JP6155595
Kind Code:
B2
Inventors:
Mutsuhiro Shimoguchi
Tomoo Okubo
Tomoo Okubo
Application Number:
JP2012231793A
Publication Date:
July 05, 2017
Filing Date:
October 19, 2012
Export Citation:
Assignee:
DIC Corporation
International Classes:
C09J175/04; C08G18/42; C08G63/127; C09J11/04; C09J11/06
Domestic Patent References:
| JP2000154363A |
Foreign References:
| WO2011162160A1 | ||||
| US20050228096 |
Attorney, Agent or Firm:
Kono Tsuyo
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