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Title:
接着剤組成物
Document Type and Number:
Japanese Patent JP7273283
Kind Code:
B2
Abstract:
The adhesive composition according to the present invention, which is capable of realizing low-temperature quick-curing properties, conductive properties, shelf life properties, and adhesive strength that are practical not only for COG mounting, but also for FOG mounting and FOP mounting, contains a cation-polymerizable component, a cation polymerization initiator, an elastomer, and a film-forming component. The cation-polymerizable component is an alicyclic epoxy compound or a low-polarity oxetane compound, and the cation polymerization initiator is a quaternary ammonium salt thermal acid generator. With respect to the total mass of the cation-polymerizable component, elastomer, and film-forming component, the cation-polymerizable component content is 10–40 mass%, the elastomer content is 10–40 mass%, and the film-forming component content is 40–80 mass%.

Inventors:
Masaaki Hattori
Application Number:
JP2018168973A
Publication Date:
May 15, 2023
Filing Date:
September 10, 2018
Export Citation:
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Assignee:
Dexerials Co., Ltd.
International Classes:
C09J163/00; C09J7/00; C09J9/02; C09J11/04; C09J11/06; C09J11/08; C09J171/10; C09J201/00
Domestic Patent References:
JP2017152354A
JP2010272546A
JP2009054377A
JP2016060761A
JP2009280790A
JP2017126595A
JP2001279215A
JP2002363506A
JP2007238751A
JP2002226822A
Foreign References:
WO2009133897A1
Attorney, Agent or Firm:
Patent Attorney Corporation Taji International Patent Office