Title:
Aluminum film adhesion method
Document Type and Number:
Japanese Patent JP6317056
Kind Code:
B2
Abstract:
This invention relates to the deposition of aluminium layers or films on a thin substrate. The method includes placing the substrate on the support; depositing a first layer of aluminium onto the substrate with the substrate in an unclamped position; and clamping the substrate to the support and depositing a second layer of aluminium continuous with the first layer wherein the second layer is thicker than the first layer and the second layer is deposited at a substrate temperature of less than 22°C.
Inventors:
Ronda Hindman
Stephen Burgess
Stephen Burgess
Application Number:
JP2012030825A
Publication Date:
April 25, 2018
Filing Date:
February 15, 2012
Export Citation:
Assignee:
SPTS Technologies Limited
International Classes:
C23C14/14; B29C65/56; H01L21/28; H01L21/285
Domestic Patent References:
| JP1150335A | ||||
| JP5211133A |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Atsushi Ebiya
Satoshi Deno
Naori Kota
Takashi Ishida
Tetsuji Koga
Atsushi Ebiya
Satoshi Deno
Naori Kota
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