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Title:
Underfill material coating device
Document Type and Number:
Japanese Patent JP6355440
Kind Code:
B2
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Inventors:
Kenji Yagi
Application Number:
JP2014118311A
Publication Date:
July 11, 2018
Filing Date:
June 09, 2014
Export Citation:
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Assignee:
Fujitsu Peripherals Co., Ltd.
International Classes:
H01L21/56; H01L21/60; H05K3/28
Domestic Patent References:
JP2002368025A
JP2008132440A
JP2011249195A
JP2001246299A
JP2001160563A
Attorney, Agent or Firm:
Akira Hirakawa
Daisuke Takada



 
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