Title:
基板コネクタ
Document Type and Number:
Japanese Patent JP7430818
Kind Code:
B2
Abstract:
The present disclosure relates to a board connector comprising a plurality of RF contacts; an insulation unit; a plurality of transmit contacts and a plurality of second RF contacts, so that the first and second RF contacts are spaced apart along a first axial direction; a ground housing; a first ground contact coupled to the insulation unit, and providing shielding between the first RF contacts and the transmit contacts, with respect to the first axial direction; and a second ground contact coupled to the insulation unit, and providing shielding between the second RF contacts and the transmit contacts, with respect to the first axial direction, wherein the first ground contact provides shielding between the first RF contacts and the transmit contacts, with respect to the first axial direction, and provides shielding between the first RF contacts with respect to a second axial direction perpendicular to the first axial direction.
Inventors:
oh sangjun
Kim, Dong Wan
Hyunju, a fan
Kim, Dong Wan
Hyunju, a fan
Application Number:
JP2022556056A
Publication Date:
February 13, 2024
Filing Date:
March 08, 2021
Export Citation:
Assignee:
LS Mtron Ltd.
International Classes:
H01R13/6585; H01R12/71
Domestic Patent References:
| JP2018110087A |
Foreign References:
| WO2020040004A1 | ||||
| WO2018025873A1 | ||||
| KR1020200008840A |
Attorney, Agent or Firm:
Manabu Miyajima
Takeshi Sekine
Daigo Sannami
Takeshi Sekine
Daigo Sannami
Previous Patent: COMMUNICATION METHODS, DEVICES AND SYSTEMS
Next Patent: Control system and charge/discharge control system
Next Patent: Control system and charge/discharge control system